PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD8L MSOP 3x3mm0502Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0256
MCP6002T-I/MS |
RFQ for MCP6002T-I/MS |
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| Technical/Catalog Information | MCP6002T-I/MS |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Packaging | Digi-Reel? |
| Amplifier Type | General Purpose |
| Number of Circuits | 2 - Dual |
| Package / Case | 8-MSOP, Micro8?, 8-uMAX, 8-uSOP, |
| Slew Rate | 0.6 V/s |
| Gain Bandwidth Product | 1MHz |
| Current - Supply | 100A |
| Current - Output / Channel | 23mA |
| Voltage - Supply, Single/Dual (±) | 1.8 V ~ 6 V |
| Output Type | Rail-to-Rail |
| -3db Bandwidth | - |
| Current - Input Bias | 1pA |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Input Offset | 4500V |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP6002T I MS MCP6002TIMS MCP6002T I MSDKR ND MCP6002TIMSDKRND MCP6002T-I/MSDKR |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP6002T-I/MS | - | - | - |